10nm LPE continues to rule the smartphones market as Qualcomm’s Snapdragon 845 and Huawei’s Kirin 970 are ready to rumble. Rumors suggested the upcoming 7nm technology which was stated to bring a revolution in the processor industry because of the compact design allowing more hardware parts to fit in the motherboard and best of all, providing almost 25% improved performance. The Snapdragon 845 can be showcased very soon this year and chances are solid that it will hit the shelves in early 2018.

pic 299 Leaks about Qualcomm Snapdragon 845 and Huawei Kirin 970

The Architecture of Snapdragon 845

The rumors and leaks related to the upcoming processors suggest that Qualcomm’s next iteration will use A75 cores and a power aware cluster with four Cortex A53 combination. This combination isn’t available on the market yet and the currently available Cortex A75 architecture can be modified and upgraded to get the wanted results. According to news from credible sources, Snapdragon 835 has got a cluster with Cortex A53 and is called as Kryo 280.

Graphics

As far as the graphics are concerned, Adreno 630 is the name that we’ve been listening to. This can bring the game to the next level as definite performance gains and energy efficiency is expected as compared to the Snapdragon 835. Other key specifications include:

  • Snapdragon X20 modem with support for 5×20 MHz channels, 256 QAM modulation, and 1.2Gbps LTE
  • Support for 802.11 a/b/g/n/ac and ad. Fudzilla reckons will set a benchmark of its own with this specification
  • UFS 2.1, 4×16 Bit LPDDR4X support

Which Smartphones Will Get Snapdragon 845?

As described in the specifications, one thing is clear that only the best of the smartphones coming after March 2018, will get it.

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Huawei Kirin 970

Kirin Leaks about Qualcomm Snapdragon 845 and Huawei Kirin 970

Launching in Q3 or Q4 this year, Kirin’s latest offering 970 will be Huawei’s answer to Qualcomm’s high-end processors. Kirin 970 will be accompanied with Cortex A73 with Quad Cortex A53. According to the details, Kirin 970 will use a 5×20 MHz 256 QAM 1.2Gbps capable modem and chances are that Mate 9‘s hardware consists of this chipset.
Other key features of Kirin 970 includes 802.11 a/b/g/n/ac. Support for UFS 2.1 and MMC is also included along with 4x16bit LPDDR4X.